用途/USAGE
适用于覆盖膜（CVL）、柔性板（FPC）、软硬结合板（RF）和薄多层板的切割成形，以及开窗盒揭盖；可扩展用于切割各种基材，如陶瓷、硅片等。Themachine is used in cutting,opening the window and uncovery forCVL/FPC/RF and thin multilayer board,as well ascutting a variety of substrates, suchas ceramic,silicon etc.
特征/CHARACTERISTICS
真正冷加工，基本无炭化；
Completely coldcutting, almost no carbonizing.
效率高，相对纳秒加工，切割速度可以提高数倍；
High effiency,timesspeed higher than nano laser cutting.
双台面，零上下料时间，题升加工效率；
Easy to usesoftware interface,easy to learn.
加工前预览功能，避免切板报废；
Preview functionbefore processing to avoid damaging sample.
相对于纳秒激光加工，碳化极其微弱;
Carbonization isextremely weak compared to nanosecond laser processing.
相对于纳秒加工，速度可提高数倍；
Speed can beincreased several times compared to nanosecondprocessing.
加工面更加精细光滑，整齐，干净；
The processingsurface is more fine, smooth, tidy and clean;
除了传统的电路板高分子材料和铜箔等加工，皮秒还可以加工，陶瓷，硅片，铁氟龙等材料；
In addition totraditional circuit board polymer materials and copper foilprocessing, picoseconds can also be processed, ceramics, siliconwafers, Teflon and other materials;
支持EMCS,MES系统，利用识别二维码自动取舍切割图形单元；
Support EMCS, MESsystem, use the identification of two-dimensional code toautomatically select and cut the graphics unit;
